Electromechanical Parts

Valve Gate Hot Runner System (2 Drops)

Product Parameters

Material: LCP+45%GF

Molding temp.: 390 ℃

Product weight: 48.72g

Product Description

For the high-temperature molding characteristics of LCP + 45% GF and the requirements of metal insert overmolding, this solution optimizes runner balance and thermal field distribution through CAE-based rheological analysis, thereby improving production stability within the narrow processing window of LCP. In response to the shear sensitivity associated with high glass fiber content and the local carbonization risk caused by high-temperature melt residence, the system employs synchronized precision valve pin control to accurately regulate pressure and flow behavior during the filling and packing stages. The symmetric runner design effectively reduces the risk of insert displacement, while optimizing flow resistance distribution and lowering anisotropic shrinkage, thereby effectively suppressing warpage and achieving precision overmolding with a flush gate vestige, no flash, and a well-bonded interface free from visible voids or delamination.